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Heat dissipation board(LED) - List of Manufacturers, Suppliers, Companies and Products

Last Updated: Aggregation Period:Jul 16, 2025~Aug 12, 2025
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Heat dissipation board Product List

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High Brightness High Current LED Heat Dissipation Substrate "MMMS Substrate"

Achieving fine three-dimensional MEMS structures through plating! It realizes high heat dissipation and can accommodate large currents.

The "Mmemus substrate" is a heat dissipation substrate for high-brightness, high-current LEDs that integrates unique plating technology with MEMS technology to accommodate various electronic devices. It achieves fine three-dimensional MEMS structures through plating. Vertical fine plating with pattern widths of several tens of micrometers is possible using semiconductor photoprocessing. High-speed film formation through plating allows for the creation of fine three-dimensional thick film structures over 50μm in thickness, and by using a unique seed layer, high reliability is achieved. 【Features】 ■ Thick film structure unique to plating (over 50μm) ■ Dense, low-stress, and high adhesion is possible - Can be created on nitrogen aluminum substrates with excellent insulation and heat resistance ■ Achieves high heat dissipation and can handle high currents - Mounting substrates for LD/LEDs and power supply circuits - MEMS components such as micro springs/switches and package cap arrays *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Other contract services
  • Circuit board design and manufacturing

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Heat-dissipating substrate "DPGA"

This is a substrate with unique high heat dissipation properties developed by Daiwa Kogyo Co., Ltd.

"DPGA" stands for "Daiwa Process Global Advance," which is a process developed independently by Daiwa Industrial that uses metal Cu bumps for interlayer wiring connections. A substrate with high heat dissipation characteristics enables high brightness and long lifespan of LEDs, as well as miniaturization of heat sinks. 【Features】 ○ Interlayer connection using metal pillars (copper bumps) → Achieves low resistance, high connection reliability, and high thermal conductivity ○ Copper bumps can be of any shape and size → For cylindrical shapes, diameters can range from 0.3 to 4.00 mm ○ Mixing of copper bumps of different sizes is possible ○ Improved thinness, lightness, and rigidity → Minimum board thickness: 0.3 mm, using prepreg for the insulation layer ○ Maximizes the functionality of LEDs → Ideal for LED substrates (liquid crystal panels, lighting) and automotive substrates For more details, please contact us or download the catalog.

  • Printed Circuit Board

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3D metal substrate, flexible heat dissipation substrate

Industry first! We can manufacture bendable metal substrates!

Curved lighting substrates, LED lighting, and light source substrates that match the casing and design are optimal. It is possible to bend a single substrate to fit the curves of automotive and scooter turn signals and tail lamps. The basic specifications as a heat dissipation substrate are equivalent to those of standard aluminum substrates, with the added performance of being bendable, making it the latest metal substrate.

  • Printed Circuit Board

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Heat dissipation substrate

Cool down the substrate!

In printed circuit boards, heat dissipation measures have become a very significant issue. Our company offers various heat dissipation substrates, including metal bases, thick copper, copper inlays, conductive paste filling, and thermal conductive materials such as ceramics. Please feel free to contact us.

  • Printed Circuit Board

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Release the heat - Matsuwa's heat dissipation board

Hot summer. Matsuwa's circuit boards are super COOL! Thick copper, metal, copper inlay boards, etc. For heat dissipation boards, please consult Matsuwa Industries.

Matsuwa Industries, renowned for its top-notch short delivery times in domestic printed circuit board manufacturing, offers a variety of heat dissipation boards with quick turnaround times. We pride ourselves on our flexibility, with a minimum order quantity starting from just one piece. If you have any issues related to heat dissipation boards, please feel free to consult us. 【Examples of Heat Dissipation Board Manufacturing】 - Thick copper boards (maximum copper thickness of 500µm) - Aluminum and copper base boards - Copper core boards - Copper inlay boards - Conductive paste resin-filled boards - High thermal conductivity materials - Ceramic boards - Thick copper FPC 【Examples of Short Delivery Manufacturing】 - Aluminum base boards: as fast as 2 days (standard 4 days and up) *For detailed services, please refer to the catalog available for download below.

  • Printed Circuit Board

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